Ziitek TIC series Phase Change Material for Superior Heat Dissipation

相变化
October 21, 2026
Video Description:
This short presentation tells the story behind Ziitek's TIC®800G Series phase change thermal interface material and its intended use cases in notebooks and electronics. Watch how the solid-at-room-temperature pad softens at 50–60°C to fill microscopic gaps, reducing contact thermal resistance. We demonstrate handling, installation, and heat dissipation performance across CPUs, GPUs, servers, and memory modules, with real application insights for B2B engineers.
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